The EX series is designed for the Ball Grid Array (BGA) chip set. Typical applications are for high volume and low wattage (1 to 3 Watt) solutions.
|Model No||Dimension (mm)||Rth(oC/W)||CAD|
|L X W||H|
Remarks: Model number EX25 E: means the heat sink made by an extrusion process, X; means cross-cutting fin, 21; means packaging footprint.