EX Series
The EX series is designed for the Ball Grid Array (BGA) chip set. Typical applications are for high volume and low wattage (1 to 3 Watt) solutions.
| Model No | Dimension (mm) | Rth(oC/W) | CAD | |
| L X W | H | |||
| EX21 | 21×21 | 10 | Click | By request |
| EX23 | 23×23 | 10 | Click | By request |
| EX25 | 25×25 | 10 | Click | By request |
| EX27 | 27×27 | 10 | Click | By request |
| EX31 | 31×31 | 10 | Click | By request |
| EX35 | 35×35 | 10 | Click | By request |
| EX37.5 | 37.5×37.5 | 10 | Click | By request |
| EX40 | 40×40 | 10 | Click | By request |
| EX42.5 | 42.5×42.5 | 10 | Click | By request |
| EX45 | 45×45 | 10 | Click | By request |
Remarks: Model number EX25 E: means the heat sink made by an extrusion process, X; means cross-cutting fin, 21; means packaging footprint.