Request a Quote

  • About Malico
  • Heat Sink
    • BGA
      • Passive Heat Sink
      • HS with Uni-Holder
      • Heat Sink With Push Pin
      • Active HS
      • Heat Sink with Talon Clip
    • Application
      • CPU
      • DC/DC Converter
      • IPC
      • North Bridge
      • LED
      • Server
    • Chipset
      • Altera Chipset
      • AMD Chipset
      • Intel Chipset
      • Xilinx Chipset
    • Accessories
      • Fan
      • Adhesive Tape & Grease
      • Spring
      • Push Pin
    • More
      • Customize
      • Search Heat Sink
  • Thermal
    • IC Package
      • Revolutionary Heat spreader
      • Copper Tungsten
    • Board Level
    • Data Center
    • Two-Phase Cooling
    • Cold Plates
  • Mechanical
    • Metal Forming
      • Die Casting
      • Forge
      • CNC
      • MIM
    • Surface Finishing
    • Brazing
    • Services
  • Markets
    • Electronics
    • Medical
    • Transportation
      • EV Car
      • EV Bus & Truck
  • Contact Us

CPU Heat Sink

Home » CPU

CPU Heat Sinks

Malico ODM has a wide range footprint for BGA heat sinks, copper embedded, high power, fix on PCB with screw sprint, straight fin.

LGA 1155/1156

LGA 1366

LGA 2011

2011 Narrow

No. 5, Minglung Rd.,
Yangmei Dist.,
Taoyuan City 32663,
Taiwan (R.O.C.)

inquiry@malico.com

Quick Links

Home
Customize
Quick Search
BGA
Copper Tungsten
Home
Customize
Quick Search
BGA
Copper Tungsten
Data Center
EV CAR
Cold plate
Medical

 

Data Center
EV CAR
Cold plate
Medical

 

About

Malico Inc. was established in 1983 as an advanced thermal solution provider. Over the years, Malico has grown and expanded significantly in related fields and is now a major metal forming company in Taiwan.

About

Malico Inc. was established in 1983 as an advanced thermal solution provider. Over the years, Malico has grown and expanded significantly in related fields and is now a major metal forming company in Taiwan.

Copyright © 2021 | MALICO INC. All rights reserved. Privacy Policy