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Altera Chipset | BGA Heat Sink | Malico

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Altera Chipset

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BGA Ball Grid Array Heat Sinks

Forge ODM wide range foot print BGA-Ball Grid Array heat sinks, that can fit on Intel, AMD, Xilinx, Freescale and NXP chip sets

Altera Packages Malico solutions Heat sink Rth
Number LxW Chipset thickness Part Number Fin/pin Shape Max. Height LxW
EP20K60EBC356-1 35 1.35 MPA35-33/3.1BU Pin 33.1 35 reference
EP20K60EBC356-1X
EP20K60EBC356-2 MWA35-33/3.1BU Elliptic 33.1 reference
EP20K60EBC356-2X
EP20K60EBC356-3 HA35-13OR Line 12.5 reference
EP20K60EFC144-1 13 1.4 MLA13-22/1.7OR Line 22 13 reference
EP20K60EFC144-1X
EP20K60EFC144-2
EP20K60EFC144-2X
EP20K60EFC144-2XN
EP20K60EFC144-3
EP20K60EFC324-1 19 1.9 MPA19-33/2.6BU Pin 32.6 19 reference
EP20K60EFC324-1N
EP20K60EFC324-1X MWA19-33/2.6BU Elliptic 32.6 reference
EP20K60EFC324-2
EP20K60EFC324-2X HA19-13BU Line 12.5 reference
EP20K60EFC324-3
EP20K60EFC324-3N
EP1AGX20CF780C6 29 MPA29-33/3.4Y Pin 33.4 29 reference
EP1AGX20CF780C6N MWA29-33/3.4Y Elliptic 33.4 reference
HA29-13Y Line 12.5 reference