Altera Chipset
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BGA Ball Grid Array Heat Sinks
Forge ODM wide range foot print BGA-Ball Grid Array heat sinks, that can fit on Intel, AMD, Xilinx, Freescale and NXP chip sets
| Altera Packages | Malico solutions | Heat sink | Rth | ||||
| Number | LxW | Chipset thickness | Part Number | Fin/pin Shape | Max. Height | LxW | |
| EP20K60EBC356-1 | 35 | 1.35 | MPA35-33/3.1BU | Pin | 33.1 | 35 | reference |
| EP20K60EBC356-1X | |||||||
| EP20K60EBC356-2 | MWA35-33/3.1BU | Elliptic | 33.1 | reference | |||
| EP20K60EBC356-2X | |||||||
| EP20K60EBC356-3 | HA35-13OR | Line | 12.5 | reference | |||
| EP20K60EFC144-1 | 13 | 1.4 | MLA13-22/1.7OR | Line | 22 | 13 | reference |
| EP20K60EFC144-1X | |||||||
| EP20K60EFC144-2 | |||||||
| EP20K60EFC144-2X | |||||||
| EP20K60EFC144-2XN | |||||||
| EP20K60EFC144-3 | |||||||
| EP20K60EFC324-1 | 19 | 1.9 | MPA19-33/2.6BU | Pin | 32.6 | 19 | reference |
| EP20K60EFC324-1N | |||||||
| EP20K60EFC324-1X | MWA19-33/2.6BU | Elliptic | 32.6 | reference | |||
| EP20K60EFC324-2 | |||||||
| EP20K60EFC324-2X | HA19-13BU | Line | 12.5 | reference | |||
| EP20K60EFC324-3 | |||||||
| EP20K60EFC324-3N | |||||||
| EP1AGX20CF780C6 | 29 | MPA29-33/3.4Y | Pin | 33.4 | 29 | reference | |
| EP1AGX20CF780C6N | MWA29-33/3.4Y | Elliptic | 33.4 | reference | |||
| HA29-13Y | Line | 12.5 | reference | ||||