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AMD Chipset | BGA Heat Sink | Malico

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AMD Chipset

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BGA Ball Grid Array heat sinks

Forge ODM wide range foot print BGA-Ball Grid Array heat sinks, that can fit on Intel, AMD, Xilinx, Freescale and NXP chip sets

AMD Packages Malico solutions Heat sink Rth
Number LxW Chipset thickness Part Number Fin/pin Shape Max. Height LxW
8151™ AGP Tunnel 31 2.75 MPA31-33/3.1Y Pin 33.1 31 reference
MWA31-33/3.1Y Elliptic 33.1 reference
8131™ PCI-X Tunnel 37.5 2.85 MPA37.5-33/3.0Y Pin 33.0 37.5 reference
MWA37.5-33/3.0Y Elliptic 33.0 reference
766™ Peripheral Bus Controller 27 1.70 MPA27-33/2.6BU Pin 32.6 27 reference
MWA27-33/2.6BU Elliptic 32.6 reference
HA27-13BU Line 12.5 reference
761™ System Controller 37.5 1.70 MPA37.5-33/2.6BU Pin 32.6 37.5 reference
MWA37.5-33/2.6BU Elliptic 32.6 reference
HA37.5-13BU Line 12.5 reference
8111™ Hyper Transport™I/O Hub 35 1.70 MPA35-33/2.6BU Pin 32.6 35 reference
MWA35-33/2.6BU Elliptic 32.6 reference
HA35-13BU Line 12.5 reference
8132 Hyper Transport™ PCI-X 2.0 Tunnel Data Sheet 35 1.70 MPA35-33/2.6BU Pin 32.6 35 reference
MWA35-33/2.6BU Elliptic 32.6 reference
HA35-13BU Line 12.5 reference