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BGA Ball Grid Array heat sinks
Forge ODM wide range foot print BGA-Ball Grid Array heat sinks, that can fit on Intel, AMD, Xilinx, Freescale and NXP chip sets
| AMD Packages | Malico solutions | Heat sink | Rth | ||||
| Number | LxW | Chipset thickness | Part Number | Fin/pin Shape | Max. Height | LxW | |
| 8151™ AGP Tunnel | 31 | 2.75 | MPA31-33/3.1Y | Pin | 33.1 | 31 | reference |
| MWA31-33/3.1Y | Elliptic | 33.1 | reference | ||||
| 8131™ PCI-X Tunnel | 37.5 | 2.85 | MPA37.5-33/3.0Y | Pin | 33.0 | 37.5 | reference |
| MWA37.5-33/3.0Y | Elliptic | 33.0 | reference | ||||
| 766™ Peripheral Bus Controller | 27 | 1.70 | MPA27-33/2.6BU | Pin | 32.6 | 27 | reference |
| MWA27-33/2.6BU | Elliptic | 32.6 | reference | ||||
| HA27-13BU | Line | 12.5 | reference | ||||
| 761™ System Controller | 37.5 | 1.70 | MPA37.5-33/2.6BU | Pin | 32.6 | 37.5 | reference |
| MWA37.5-33/2.6BU | Elliptic | 32.6 | reference | ||||
| HA37.5-13BU | Line | 12.5 | reference | ||||
| 8111™ Hyper Transport™I/O Hub | 35 | 1.70 | MPA35-33/2.6BU | Pin | 32.6 | 35 | reference |
| MWA35-33/2.6BU | Elliptic | 32.6 | reference | ||||
| HA35-13BU | Line | 12.5 | reference | ||||
| 8132 Hyper Transport™ PCI-X 2.0 Tunnel Data Sheet | 35 | 1.70 | MPA35-33/2.6BU | Pin | 32.6 | 35 | reference |
| MWA35-33/2.6BU | Elliptic | 32.6 | reference | ||||
| HA35-13BU | Line | 12.5 | reference | ||||