Adhesive, Tape & Grease
Adhesive, Tape & Grease
All standard heat sinks have options to include pre-applied thermal interface material upon request. The dimension of the thermal interface material will be 1mm smaller than the corresponding heat sink from each side. General guidelines for thermal interface material are available for reference.
For microprocessors, DC/DC converters, and power modules, the phase change material is recommended. The material is rigid at room temperature and will get soften as the component reaches operating temperature. In addition, it has the ability to completely fill interface air gaps and voids presented in typical component packages and heat sinks.
Phase Change Material
| Type | Standand Size |
color | Operating Temperature (℃) |
Thermal impedance (℃ -in2/W) |
Thermal conductivity W/mK |
Thickness | Manufacturer |
|---|---|---|---|---|---|---|---|
| T725 | pink | -60 to +125 | 0.03 @ 50psi | 0.7 | 0.13(mm) [0.005″] | Chomerics | |
| T710 | light gray | -60 to +125 | 0.1 @ 5psi | 0.7 | 0.13(mm) [0.005″] | Chomerics | |
| Hi Flow 105 | dark gray | -30 to +120 | 0.37 @ 25psi | 0.9 | 0.14(mm) [0.006″] | Bergquist | |
| PCS-TC-11 | gray | -40 to +125 | 0.04 @75um | 3.8 | 0.13(mm) [0.005″] | shin-ersu |
For plastic molded IC packages, Chomerics T411, and 3M 8810, 8815 are recommended. These tapes consist of a pressure-sensitive adhesive with an expanded aluminum mesh carrier layer or thermally conductive fillers and allows the tapes to conform well to non-flat substrates.
Double-Sided Tape
| Type | Standand Size |
color | Operating Temperature (℃) |
Thermal impedance (℃ -in2/W) |
Thermal conductivity W/mK |
Thickness | Manufacturer |
|---|---|---|---|---|---|---|---|
| T410 | white | -50 to +150 | 1.1 @ <1 psi | 0.18(mm) [0.007″] | |||
| T411 | clear(silver) | -50 to +150 | 1.0 @ <1 psi | 0.5 | 0.28(mm) [0.011″] | Chomerics | |
| T412 | gray | -30 to +125 | 0.25 @ <1 psi | 1.4 | 0.23(mm) [0.009″] | Chomerics | |
| 8810 | white | 0.9 | 0.6 | 0.25(mm) [0.01″] |
3M, 8810 | ||
| 8815 | white | 1.2 | 0.6 | 0.375(mm) [0.015″] | 3M, 8815 |
For plastic molded IC package, Chomerics T411, and 3M 8810, 8815 are recommended. These tapes consist of a pressure-sensitive adhesive with an expanded aluminum mesh carrier layer or thermally conductive fillers and allows the tapes to conform well to non-flat substrates.
Gap Filling Material
| Type | Standand Size |
color | Operating Temperature (℃) |
Thermal impedance (℃ -in2/W) |
Thermal conductivity W/mK |
Thickness | Manufacturer |
|---|---|---|---|---|---|---|---|
| Li-98 | white | -30 to +120 | 1.0 @ <1 psi | 0.95 | 0.15(mm) [0.006″] | T-global | |
| T-PCM905C | yellow | -25 to +125 | 0.048 @ 10psi | 0.7 | 0.13(mm) [0.005″] | Laird | |
| T-PCM585 | gray | -40 to +125 | 0.02 @ <10 psi | 3.8 | 0.13(mm) [0.005″] | Laird |
For special impedance request, we propose the grease PSX-D. Grease is suitable for heat sinks and variety of heat dissipating components. During the air flow, it expels from the interface which reduces thermal impedance and the material becomes highly thermal transferable.
Grease
| Type | color | Operating Temperature (℃) |
Thermal impedance (℃ -in2/W) |
Thermal conductivity W/mK |
Weight | Manufacturer |
|---|---|---|---|---|---|---|
| PSX-D | gray | -40 to 200 | 0.009 | 3.4 | Henkel | |
| SC102 | white | -45 to 200 | 0.62 @ 40psi | 0.8 | 1g | Dow Corning |
| STC 640 | gray paste | -50 to +155 | 0.012 @ 50psi | 1.8 | 1g | |
| AS5 | Silver | Peak: –50 to >180 Long-Term: –50 to 130 |
<0.0045 (0.001 inch layer) |
>350,000 (0.001 inch layer) |
3.5g | Arctic, >Arctic Silver® 5 |
| CMQ-1G | white | Peak: –150 to >185 Long-Term: –150 to 130 |
<0.007 (0.001 inch layer) |
>200,000 (0.001 inch layer) |
1g | Arctic, Céramique™ 2 |
Standard thermal pad and grease are shown in the table above. Additional materials to meet specific requirement are also available upon request.
Remark
Thermal pad or grease size is 1mm smaller than heat sink at every side .
For example :
Heat sink base 35x35mm(=A) , the thermal pad and thermal grease size will be at 33x33mm(=A-2).
