Intel 4677 – Performance & Specifications

Engineered for high-performance server environments, the Intel 4677 cold plate from Malico delivers exceptional thermal efficiency for LGA 4677 and 4710 CPUs. Constructed from precision-machined copper, it features an ultra-compact footprint (118 × 78 × 24 mm) and supports a thermal design power (TDP) of up to 500W. With a fine microchannel structure — including a 0.2 mm fin thickness and 0.5 mm fin gap — the cold plate ensures optimal heat dissipation while maintaining minimal pressure drop across a wide flow rate range. Compatible with Parker Push-Lok 1/4″ tubing, it is designed for easy integration and robust durability. Whether deployed in AI, HPC, or hyperscale infrastructure, this cold plate is ideal for demanding data center cooling applications.

Intel 4677 – Assembly Guide

Assembly Guide

1.Before installation, follow the sticker instructions to ensure all wires are in the unlocked position.

2.Place the Processor Heat Sink Module onto the bolster plate and move all wires into the locked position.

3.Use a Torx T30 screwdriver and set the torque to 9.2 kgf-cm (8 lbf-in).

4.Ensure all heat sink mounting screws are vertical during installation.

5.Tighten the two diagonal mounting screws (#1 and #2) one at a time until fully secured.

6.Repeat the process for the remaining two diagonal mounting screws.