All of our standard series heat sinks can be ordered with pre-applied thermal interface material as your requirements. The size of thermal interface material applied will shrink 1mm from every side of the heat sink selected or be the dimensions customer required. There are some general guidelines for choosing the thermal interface material.

For microprocessors, DC/DC converters and power modules, the phase change material are recommended. At room temperature, they are solid and will softens as it reaches component operating temperatures. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks.  We offer T710 and T725 for your selection.

Phase Change Material

For plastic molded IC package, Chomerics T411, and 3M 8810, 8815 are recommended. These tapes consist of a pressure-sensitive adhesive with an expanded aluminum mesh carrier layer or thermally conductive fillers and allows the tapes to conform well to non-flat substrates.

Double Sided Tape

For special thermal impedance demand, we provide PSX-D. The grease is suitable for use between a heat sink and a variety of heat dissipating components. Upon flow, air is expelled from the interface, reducing thermal impedance and the material performs as a highly efficient thermal transfer material.

The thermal pad or thermal grease shown within the table are standard options . Additional materials are also available to help meet specific requirements.

Remark

Thermal pad or grease size is 1mm smaller than heat sink at every side .

For example :
Heat sink base 35x35mm(=A) , the thermal pad and thermal grease size will be at 33x33mm(=A-2).