EX Series

The EX series is designed for the Ball Grid Array (BGA) chip set. Typical applications are for high volume and low wattage (1 to 3 Watt) solutions.

 

	Model No	Dimension (mm)		Rth(oC/W)	CAD
		L X W	H
	EX21	21x21	10	Click	By request
	EX23	23x23	10	Click	By request
	EX25	25x25	10	Click	By request
	EX27	27x27	10	Click	By request
	EX31	31x31	10	Click	By request
	EX35	35x35	10	Click	By request
	EX37.5	37.5x37.5	10	Click	By request
	EX40	40x40	10	Click	By request
	EX42.5	42.5x42.5	10	Click	By request
	EX45	45x45	10	Click	By request

Remarks:
Model number EX21 E: means the heat sink made by extrusion process,X;means cross cutting fin ,21 ; means packaging foot print.